a public good project by the
Synthesis
Company
of California

© 2026

Junho Lee | doi.page

0 works0 citations0 h-index

Junho Lee

Daegu Gyeongbuk Institute of Science and Technology(KR)Yonsei University(KR)

Publications by Year

Research Areas

3D IC and TSV technologies, Electromagnetic Compatibility and Noise Suppression, 2D Materials and Applications, Graphene research and applications, Semiconductor materials and devices

Most-Cited Works

→ Visualization of asymmetric wetting ridges on soft solids with X-ray microscopy(2014)196 cited
→ Water resistance and mechanical properties of biopolymer (alginate and soy protein) coated paperboards(2005)177 cited
→ Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring(2011)165 cited
→ PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models(2011)128 cited
→ Increase in water resistance of paperboard by coating with poly(lactide)(2007)114 cited
→ Modeling on the size dependent properties of InP quantum dots: a hybrid functional study(2013)84 cited
→

Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer

(2009)

70 cited

Mechanical and Water Barrier Properties of Soy Protein and Clay Mineral Composite Films(2005)

→ Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects(2012)57 cited

→ High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions(2005)56 cited