Dae Hyun Kim
Chosun University(KR)
Publications by Year
Research Areas
3D IC and TSV technologies, Semiconductor materials and devices, Interconnection Networks and Systems, Thin-Film Transistor Technologies, VLSI and FPGA Design Techniques
Most-Cited Works
- → Simulation and model validation of sheet and tube type photovoltaic thermal solar system and conventional solar collecting system in transient states(2012)222 cited
- → A study of Through-Silicon-Via impact on the 3D stacked IC layout(2009)200 cited
- → 3D-MAPS: 3D Massively Parallel Processor with Stacked Memory(2012)134 cited
- → Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout(2012)97 cited
- → Fast and Accurate Analytical Modeling of Through-Silicon-Via Capacitive Coupling(2011)85 cited
- → Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory(2010)76 cited
- → Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs(2009)65 cited
- → Inherently Area‐Selective Atomic Layer Deposition of SiO2 Thin Films to Confer Oxide Versus Nitride Selectivity(2021)64 cited
- → Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)(2013)64 cited