Gang Li
Publications by Year
Research Areas
Advanced Sensor and Energy Harvesting Materials, Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Epoxy Resin Curing Processes, Conducting polymers and applications
Most-Cited Works
- → Graded intrafillable architecture-based iontronic pressure sensor with ultra-broad-range high sensitivity(2020)754 cited
- → Highly Conducting and Stretchable Double‐Network Hydrogel for Soft Bioelectronics(2022)399 cited
- → Highly stable flexible pressure sensors with a quasi-homogeneous composition and interlinked interfaces(2022)388 cited
- → High-Strength, Tough, Fatigue Resistant, and Self-Healing Hydrogel Based on Dual Physically Cross-Linked Network(2016)357 cited
- → Graded Interlocks for Iontronic Pressure Sensors with High Sensitivity and High Linearity over a Broad Range(2022)305 cited
- → Iontronic pressure sensor with high sensitivity and linear response over a wide pressure range based on soft micropillared electrodes(2021)236 cited
- → Flexible Asymmetrical Solid-State Supercapacitors Based on Laboratory Filter Paper(2015)232 cited
- → Embedment of sensing elements for robust, highly sensitive, and cross-talk–free iontronic skins for robotics applications(2023)196 cited
- → Core–shell SiO2@RGO hybrids for epoxy composites with low percolation threshold and enhanced thermo-mechanical properties(2014)177 cited
- → Ultrafast Self-Healing Nanocomposites via Infrared Laser and Their Application in Flexible Electronics(2017)128 cited