Yongping Lei
Beijing University of Technology(CN)Xinjiang University(CN)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Welding Techniques and Residual Stresses, Advanced Welding Techniques Analysis, Metal Alloys Wear and Properties, 3D IC and TSV technologies
Most-Cited Works
- → Modelling of keyhole dynamics and porosity formation considering the adaptive keyhole shape and three-phase coupling during deep-penetration laser welding(2011)169 cited
- → Measurement of residual stress in arc welded lap joints by cosα X-ray diffraction method(2016)161 cited
- → Effect of electron beam welding on the microstructures and mechanical properties of thick TC4-DT alloy(2011)139 cited
- → Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy(2008)132 cited
- → Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder(2007)121 cited
- → Laser cladding in-situ NbC particle reinforced Fe-based composite coatings with rare earth oxide addition(2013)118 cited