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Ying-Ju Lu | doi.page

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Ying-Ju Lu

Siliconware Precision Industries (Taiwan)(TW)

Research Areas

Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Nanofabrication and Lithography Techniques

Most-Cited Works

→ Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)(2018)23 cited