Jay Im
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Advancements in PLL and VCO Technologies, Semiconductor materials and devices, Copper Interconnects and Reliability
Most-Cited Works
- → Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing(2007)206 cited
- → Thermo-mechanical reliability of 3-D ICs containing through silicon vias(2009)206 cited
- → A 56-Gb/s PAM4 Wireline Transceiver Using a 32-Way Time-Interleaved SAR ADC in 16-nm FinFET(2017)156 cited
- → Thermal stress induced delamination of through silicon vias in 3-D interconnects(2010)124 cited
- → Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints(2006)121 cited
- → Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique(2012)115 cited
- → A 112-Gb/s PAM-4 Long-Reach Wireline Transceiver Using a 36-Way Time-Interleaved SAR ADC and Inverter-Based RX Analog Front-End in 7-nm FinFET(2020)112 cited
- → Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects(2012)111 cited
- → Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias(2012)104 cited
- → 6.1 A 112Gb/s PAM-4 Long-Reach Wireline Transceiver Using a 36-Way Time-Interleaved SAR-ADC and Inverter-Based RX Analog Front-End in 7nm FinFET(2020)83 cited