Chao-Kai Hsu
Industrial Technology Research Institute(TW)National Cheng Kung University Hospital(TW)National Cheng Kung University(TW)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability, Additive Manufacturing and 3D Printing Technologies, Advancements in Photolithography Techniques
Most-Cited Works
- → Biocompatible, Antibacterial, and Stable Deep Eutectic Solvent-Based Ionic Gel Multimodal Sensors for Healthcare Applications(2023)48 cited
- → Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology(2015)28 cited
- → Performance and process characteristic of glass interposer with through-glass-via(TGV)(2013)20 cited
- → Process, assembly and electromigration characteristics of glass interposer for 3D integration(2014)18 cited
- → A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices(2014)12 cited
- → A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via(2008)10 cited