Vempati Srinivasa Rao
Advanced Numerical Research and Analysis Group(IN)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Nanofluid Flow and Heat Transfer, Heat Transfer Mechanisms, Fluid Dynamics and Turbulent Flows
Most-Cited Works
- → Thermal radiation impact on MHD heat transfer natural convective nano fluid flow over an impulsively started vertical plate(2020)222 cited
- → Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications(2016)125 cited
- → Chemical reaction impact on MHD natural convection flow through porous medium past an exponentially stretching sheet in presence of heat source/sink and viscous dissipation(2021)118 cited
- → Effects of soret, dufour, hall current and rotation on MHD natural convective heat and mass transfer flow past an accelerated vertical plate through a porous medium(2020)102 cited
- → Development of 3D silicon module with TSV for system in packaging(2008)78 cited
- → Thermal radiation and Joule heating effects on a magnetohydrodynamic Casson nanofluid flow in the presence of chemical reaction through a non-linear inclined porous stretching sheet(2020)70 cited
- → Multiple slip effects on steady MHD flow past a non-isothermal stretching surface in presence of Soret, Dufour with suction/injection(2022)64 cited
- → TSV interposer fabrication for 3D IC packaging(2009)61 cited
- → A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist(2006)46 cited
- → An impact on non-Newtonian free convective MHD Casson fluid flow past a vertical porous plate in the existence of Soret, Dufour, and chemical reaction(2022)46 cited