Yufeng Jin
Chongqing University(CN)Shenzhen University(CN)Peking University(CN)Beijing University of Technology(CN)San’an Optoelectronics (China)(CN)Peking University Shenzhen Hospital(CN)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Electrical and Thermal Properties of Materials, Semiconductor materials and devices, Advanced Sensor and Energy Harvesting Materials
Most-Cited Works
- → Recent Advancements in Flexible and Stretchable Electrodes for Electromechanical Sensors: Strategies, Materials, and Features(2017)443 cited
- → Mobile Human Airbag System for Fall Protection Using MEMS Sensors and Embedded SVM Classifier(2009)156 cited
- → Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond(2017)119 cited
- → A flexible strain sensor based on CNTs/PDMS microspheres for human motion detection(2020)111 cited
- → Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips(2022)72 cited
- → Low ON-Resistance GaN Schottky Barrier Diode With High <inline-formula> <tex-math notation="LaTeX">$V_{\mathrm{ON}}$ </tex-math> </inline-formula> Uniformity Using LPCVD SiN Compatible Self-Terminated, Low Damage Anode Recess Technology