P.P.H. Tsang
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Aluminum Alloys Composites Properties, Semiconductor materials and interfaces, Integrated Circuits and Semiconductor Failure Analysis
Most-Cited Works
- → Characterization of Intermetallic Compound Formation and Copper Diffusion of Copper Wire Bonding(2006)15 cited
- → Effects of Al Pad Deformation and TiW Barrier Layer on Copper-to-Silicon Diffusion and Intermetallic Compound Formation in Copper Wire Bonding(2006)5 cited
- → Three dimensional flow analysis for incomplete fill failure during matrix array transfer molding of small QFN packages(2013)2 cited
- → Characteristics of Copper-to-Silicon diffusion in copper wire bonding(2007)1 cited
- Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding(2007)
- → Snap Cure Wafer Back Glue Coating as Die Attach Method for Transistor and Diode Dice(2006)