Huan‐Chun Fu
Industrial Technology Research Institute(TW)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Semiconductor Lasers and Optical Devices, Photonic and Optical Devices, Additive Manufacturing and 3D Printing Technologies
Most-Cited Works
- → Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration(2011)40 cited
- → Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration(2012)32 cited
- → Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology(2015)28 cited
- → Yield enhancement for WSI array processors using two-and-half-track switches(2002)26 cited
- → A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application(2012)22 cited
- → Performance and process characteristic of glass interposer with through-glass-via(TGV)(2013)20 cited
- → Wafer-level 3D integration using hybrid bonding(2010)20 cited
- → Process, assembly and electromigration characteristics of glass interposer for 3D integration(2014)18 cited
- → Investigation of the process for glass interposer(2013)15 cited
- → Feasibility Study of Nanotwinned Copper and Adhesive Hybrid Bonding for Heterogeneous Integration(2021)15 cited