Y.Y. Lin
MediaTek (China)(CN)
Publications by Year
Research Areas
Mechanical Behavior of Composites, Adhesion, Friction, and Surface Interactions, Polymer crystallization and properties, Fatigue and fracture mechanics, Electronic Packaging and Soldering Technologies
Most-Cited Works
- → Constraints on Microcontact Printing Imposed by Stamp Deformation(2002)422 cited
- → Cavity growth from crack-like defects in soft materials(2004)83 cited
- → The mechanics of contact and adhesion of periodically rough surfaces(2001)73 cited
- → The Role of Viscoelastic Adhesive Contact in the Sintering of Polymeric Particles(2001)50 cited
- → Modeling the failure of an adhesive layer in a peel test(2002)26 cited
- → Rheological properties and adhesive failure of thin viscoelastic layers(2002)24 cited
- → Small scale geometric and material features at geometric discontinuities and their role in fracture analysis(2001)22 cited
- → Singularities of an inclined crack terminating at an anisotropic bimaterial interface(1997)20 cited
- → Bonding of a viscoelastic periodic rough surface to a rigid layer(2002)12 cited
- → Characterizations of the Perpendicular Magnetic Anisotropy in Ultrathin Films of Ta-CoFeB-MgO by X-Ray Photoelectron Spectroscopy(2013)4 cited