Kripesh Vaidyanathan
Northeastern University(US)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Gastrointestinal Bleeding Diagnosis and Treatment, Gastric Cancer Management and Outcomes, Electromagnetic Compatibility and Noise Suppression
Most-Cited Works
- → Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps(2009)291 cited
- → Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules(2010)58 cited
- → Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer(2011)54 cited
- → A novel method to predict die shift during compression molding in embedded wafer level package(2009)52 cited
- → Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects(2009)42 cited
- → Large scale microcomponents assembly using an external magnetic array(2007)37 cited
- → Effect of TSV interposer on the thermal performance of FCBGA package(2009)37 cited
- → High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)(2010)33 cited
- → Copper Interconnections for High Performance and Fine Pitch Flipchip Digital Applications and Ultra-Miniaturized RF Module Applications(2006)33 cited