Thiam Beng Lim
Institute of Microelectronics(SG)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Material Properties and Processing, Adhesion, Friction, and Surface Interactions, Surface Modification and Superhydrophobicity
Most-Cited Works
- → Moisture diffusion and vapour pressure modeling of IC packaging(2002)98 cited
- → Advances in Vapor Pressure Modeling for Electronic Packaging(2006)34 cited
- → Chemical Modification of Silicon (100) Surface via UV-Induced Graft Polymerization(1999)34 cited
- MODELING OF WHOLE FIELD VAPOR PRESSURE DURING REFLOW FOR FLIP CHIP BGA AND WIRE BOND PBGA PACKAGES(1999)
- → Analytical Solutions for Interconnect Stress in Board Level Drop Impact(2007)28 cited
- → Investigation of under bump metallization systems for flip-chip assemblies(2002)20 cited
- → Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization(2000)16 cited
- → Adhesion improvement of a poly(tetrafluoroethylene)- copper laminate by thermal graft copolymerization(1998)15 cited
- → Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper(1999)14 cited
- → Enhancing moisture resistance of PBGA(2002)14 cited