Betty Yeung
NXP (Germany)(DE)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Advanced Surface Polishing Techniques, Integrated Circuits and Semiconductor Failure Analysis, Advanced Welding Techniques Analysis
Most-Cited Works
- → An overview of experimental methodologies and their applications for die strength measurement(2003)70 cited
- → Microstructure and Mechanical Properties of Electroplated Cu Thin Films(2000)55 cited
- → Characterization of lead-free solders and under bump metallurgies for flip-chip package(2002)55 cited
- → Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder(2002)38 cited
- → Assessment of backside processes through die strength evaluation(2000)34 cited
- → Encapsulated double-bump WL-CSP: design and reliability(2002)22 cited
- → Evaluation and optimization of package processing and design through solder joint profile prediction(2003)19 cited
- → Wafer level and flip chip design through solder prediction models and validation(2001)13 cited
- → JACS-Pak/sup TM/ flip-chip chip scale package development and characterization(2002)7 cited