Chang-Fu Lin
Siliconware Precision Industries (Taiwan)(TW)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Education and Learning Interventions, Additive Manufacturing and 3D Printing Technologies, Manufacturing Process and Optimization
Most-Cited Works
- → Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)(2018)23 cited
- → Construction of FO-MCM with C4 Bumps Built First Using Chip Last Assembly Technology(2019)7 cited
- → Advanced nano-Ag thermal interface material for high thermal flip chip BGA(2016)6 cited
- → Process Induced Wafer Warpage Optimization for Multi-chip Integration on Wafer Level Molded Wafer(2019)4 cited
- → Thermal compression bonding challenge: Interposer attachment technology for next generation package-on-package structure(2017)3 cited
- → Formation behavior of intermetallic compound in solder joint assembly within fluxless bonding(2018)2 cited
- → An Experimental Study of Integrating LEGO Robots Instruction into the “Engine Principles and Practice” Curriculum at Automobile Departments in Vocational Schools(2015)2 cited
- → Study on Teaching Efficiency and Teaching Faith of Career Development Education for Junior High School Teachers(2015)1 cited
- → Fluxless Flip Chip Bonding Tech Application for Ultra-High Density Micro-bump Structure(2018)
- → A Study on Hospitality and Tourism Teachers' Teaching Competence to Use Inquiry-Based Teaching into “Project Study” Curriculum of Senior High and Vocational Schools(2015)