Y.C. Chan
National Taiwan University(TW)National Tsing Hua University(TW)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Advanced Welding Techniques Analysis, Intermetallics and Advanced Alloy Properties, Copper Interconnects and Reliability
Most-Cited Works
- → Failure mechanisms of solder interconnects under current stressing in advanced electronic packages(2010)272 cited
- → Research advances in nano-composite solders(2008)229 cited
- → Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder(2005)146 cited
- → Growth kinetics of intermetallic compounds in chip scale package solder joint(2001)139 cited
- → Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films(2010)137 cited
- → Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder(2005)130 cited