Underpotential deposition of copper on electrochemically treated polycrystalline Au surfaces
Journal of Chemical Sciences1991Vol. 103(5), pp. 677–683
Citations Over Time
Related Papers
- → Recent Advances in Electroplating of Through-Hole Copper Interconnection(2021)55 cited
- → In situ scanning tunneling microscopy of underpotential deposition in aqueous solution III. Silver adlayers on Au(111)(1992)73 cited
- → Underpotential deposition of copper on electrochemically treated polycrystalline Au surfaces(1991)3 cited
- A Model for Voltammograms of the Underpotential Deposition of Metals(1991)
- A New Technique for Increasing the Electroplating Ratio during the Manufacture of Electroplated Diamond Tools(2002)