Role of Gas Doping Sequence in Surface Reactions and Dopant Incorporation during Atomic Layer Deposition of Al-Doped ZnO

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Abstract

Aluminum incorporation into ZnO films during atomic layer deposition (ALD) is investigated using in situ quartz crystal microbalance and electrical conductance analysis. Chemical interactions between Zn and Al species during ZnO:Al ALD depend on the order of metal precursor exposure. Exposing the growing ZnO surface to trimethyl aluminum (TMA) impedes the subsequent ∼4 monolayers of ZnO growth. However, the extent of interaction can be reduced by performing the TMA exposure immediately following a diethyl zinc step, without an intermediate water exposure step, consistent with increased surface mixing of Zn and Al species. Infrared spectroscopy analysis of heavily aluminum doped ZnO shows features consistent with the presence of amorphous ZnAl2O4 bonding units. For more lightly doped films, mass spectroscopic depth profiling confirms nonuniform aluminum distribution, even after annealing at 500 °C. Film conductance measured during growth shows complex trends that are highly repeatable over multiple doping cycles, and values for in situ conductance are consistent with postdeposition current vs. voltage characterization. Results are understood in terms of relative bonding energies of surface species, and expected reaction pathways for dopant atom incorporation.

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