B3.2 - A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers

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Abstract

In this work, we will describe a promising procedure for the development of a silicon based micro electro mechanical system (MEMS) suitable for 300C operation temperature. Design aspects as well as a suitable packaging concept and technology will be highlighted. The value of accompanying FEM simulations together with the usage of novel reliability tools will be demonstrated as a design and construction accelerator that can help to avoid typical mistakes within the material selection and concept phase of a MEMS fabrication process. We will give an introduction for suitable wafer-levelbonding methods for multilayer stacking of functional substrates especially for the heterogeneous integration of silicon and low temperature co-fired ceramic LTCC. The fabrication process for LTCC with electrical feed troughs and for Silicon substrates with through silicon vias TSVs and a subsequent electrical interconnection between both will also be topics of this work.

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