Yu-Chung Hsieh
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Additive Manufacturing and 3D Printing Technologies, Manufacturing Process and Optimization, Semiconductor Lasers and Optical Devices
Most-Cited Works
- → 20" x 20" Panel Size Glass IPD Interposer Manufacturing(2016)13 cited
- → Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP Application(2016)2 cited
- → Glass 3D Solenoid Inductors IPD Substrate Manufacturing Assembly and Characterization(2016)2 cited
- → Nondestructive Disassembly System for White Board Marker(2006)1 cited