20" x 20" Panel Size Glass IPD Interposer Manufacturing

Citations Over TimeTop 15% of 2016 papers

Abstract

For RF applications, 3D IPD (integrated passive devices) technology could cover a wide frequency range from 100 MHz to 20GHz and above. It is suitable for the application of LTE, 5G and beyond. The advantages include reducing power consumption and providing small form factor. Glass is good candidate that can be used in IPD industry. The infrastructure of glass for LCD industry has already been developed for many years. Glass also has several superior properties than other substrate candidates; such as large panel size availability, adjustable CTE, high modulus, low dielectric constant, low dielectric loss and high insulating nature. Glass represents an attractive choice with potential of modifiable properties dependent on specific glass composition. By tailoring the coefficient of thermal expansion (CTE), the CTE of glass can be made to match perfectly with silicon dies and for reliable package. The introduction of through glass vias (TGV) in glass allows for the 3D solenoid inductors as opposed to planar inductors. In addition, the advantages of using glass for IPD derive from process flexibility for size and thickness since the glass fusion process provides sheets with dimensions of more than three meters. It is straightforward to produce glass substrates of almost any size needed. Large glass panels are ideally suited for fabrication of IPD interposer where the panel process is expected to provide large number of interposers in each run compared with wafer processing. Additionally, the two sided processing of the panel, the avoidance of CMP processes further enable lower unit cost for the interposer. Consequently, glass is an ideal interposer material due to its insulating property, large panel size availability, high modulus and ability to tailor CTE [4]-[11]. This paper demonstrates fabrication of 3D inductor with through glass vias (TGV) and MIM structure using a 20"'20" (508mm'508mm) panel size manufactured by IC (integrated circuit) substrate HVM (high volume manufacture) line for glass IPD application.

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