Chun-Hsien Chien
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Additive Manufacturing and 3D Printing Technologies, Semiconductor Lasers and Optical Devices, Copper Interconnects and Reliability
Most-Cited Works
- → Racetrack memory cell array with integrated magnetic tunnel junction readout(2011)93 cited
- → Through-Silicon Hole Interposers for 3-D IC Integration(2014)46 cited
- → Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration(2013)42 cited
- → Process integration of 3D Si interposer with double-sided active chip attachments(2013)25 cited
- → Performance and process characteristic of glass interposer with through-glass-via(TGV)(2013)20 cited
- → Process, assembly and electromigration characteristics of glass interposer for 3D integration(2014)18 cited
- → Investigation of the process for glass interposer(2013)15 cited
- → 20" x 20" Panel Size Glass IPD Interposer Manufacturing(2016)13 cited
- → Low-cost TSH (through-silicon hole) interposers for 3D IC integration(2014)13 cited
- → Thermal Characteristic and Performance of the Glass Interposer with TGVs (Through-Glass Via)(2013)12 cited