Low-cost TSH (through-silicon hole) interposers for 3D IC integration
2014Vol. 2, pp. 290–296
Citations Over TimeTop 14% of 2014 papers
John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan, Sheng-Tsai Wu, Fang‐Lin Chao, Ming-Ji Dai, Ra-Min Tain, Heng-Chieh Chien, Chun-Hsien Chien, Ren-Shin Cheng, Yu-Wei Huang, Yuan‐Chang Lee, Zhi-Cheng Hsiao, Wen‐Li Tsai, P.-R. Chang, Huan‐Chun Fu, Yu-Mei Cheng, Li-Ling Liao, Wei‐Chung Lo, Ming‐Jer Kao
Abstract
In this investigation, a SiP (system-in-package) which consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top- and bottom-side (a real 3D IC integration) is studied. Emphasis is placed on the fabrication of a test vehicle to demonstrate the feasibility of this SiP technology. The design, materials, and process of the top-chip, bottom-chip, TSH interposer, and final assembly will be presented. Shock and thermal cycling tests will be preformed to demonstrate the integrity of the SiP structure.
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