Ra-Min Tain
Powertech Technology (Taiwan)(TW)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Additive Manufacturing and 3D Printing Technologies, Advanced Surface Polishing Techniques, Semiconductor Lasers and Optical Devices
Most-Cited Works
- → Cooling performance of silicon-based thermoelectric device on high power LED(2005)75 cited
- → Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications(2012)50 cited
- → Through-Silicon Hole Interposers for 3-D IC Integration(2014)46 cited
- → Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)(2012)29 cited
- → Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape(2000)25 cited
- → Critical heat flux measurements in a round tube for CFCs and CFC alternatives(1993)22 cited
- → Estimation for equivalent thermal conductivity of silicon-through vias TSVs used for 3D IC integration(2011)18 cited
- → Energy release rate investigation for through silicon vias (TSVs) in 3D IC integration(2011)17 cited
- → Embedded glass interposer for heterogeneous multi-chip integration(2015)17 cited