Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications

Citations Over TimeTop 10% of 2012 papers

Abstract

In this study, we used simulation technique to analyze the thermal behaviors and investigate the thermal issues of a designed system in package (SiP) for network system application that based on a three dimensional integrated circuit (3D IC) structure. The 3D IC SiP has an interposer which with regularly embedded through-silicon vias (TSVs); there are one CPU chip and two DRAM chips planted on the top side and bottom side of the interposer, respectively. The interposer with chips is bonded on a BT substrate; the BT substrate is bonded on a PCB; and a metallic heat spreader is placed on and glued to the CPU chip's back-side. Because a 3D IC SiP with TSVs is so complicate for modeling and very difficult for meshing, this study attempted to use the equivalent models of embedded TSV, bump/solder bond and metallic trace to simplify a detail 3D IC model. We introduced a slice model, that four stacked chips on an interposer and each chip has two heaters and TSVs, to verify the accuracy and feasibility of the equivalent model by comparing to the detail model, the results of both models show that they are in a good agreement. By using the equivalent model to simulate the studied 3D IC integrated SiP; we found the CPU temperature would be dominated by the cooling capability of a thermal module that attached on the heat spreader. As for the DRAM chips that underneath the interposer, it is inevitable to have a quite high temperature due to the temperature superposition effect and an obstructed heat flow path. In fact, the severely high temperature of the chips under an interposer should be the main thermal issue for such a 3D IC SiP because there is no easy thermal solution for these chips.

Related Papers

• → Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration(2011)180 cited
• → The Most Cost-Effective Integrator (TSV Interposer) for 3D IC Integration System-in-Package (SiP)(2011)22 cited
• Evolution, Challenge, and Outlook of TSV (Through-Silicon Via) and 3D IC/Si Integration(2011)
• → Thermal Analysis of 3D package using TSV Interposer(2014)4 cited
• TSV 인터포저 기술을 이용한 3D 패키지의 방열 해석(2014)