Ming-Ji Dai
Industrial Technology Research Institute(TW)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Advanced Thermoelectric Materials and Devices, Additive Manufacturing and 3D Printing Technologies, Thermal Radiation and Cooling Technologies
Most-Cited Works
- → Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications(2012)50 cited
- → Thermal conductivity of Si/SiGe superlattice films(2008)49 cited
- → Through-Silicon Hole Interposers for 3-D IC Integration(2014)46 cited
- → Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration(2013)42 cited
- → Electro-thermal finite element analysis and verification of power module with aluminum wire(2014)31 cited
- → Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)(2012)29 cited
- → High efficiency silicon-based high power LED package integrated with micro- thermoelectric device(2007)24 cited
- → Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP(2012)21 cited
- → Characteristics of Thermal Resistance for High Power LEDs(2008)18 cited
- → Estimation for equivalent thermal conductivity of silicon-through vias TSVs used for 3D IC integration(2011)18 cited