Fang‐Lin Chao
China Telecom (China)(CN)China Telecom
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Semiconductor materials and devices, Silicon and Solar Cell Technologies, Electromagnetic Compatibility and Noise Suppression
Most-Cited Works
- → A “smarter-cut” approach to low temperature silicon layer transfer(1998)103 cited
- → Cooling performance of silicon-based thermoelectric device on high power LED(2005)75 cited
- → Fundamental issues in wafer bonding(1999)73 cited
- → Laddering wave in serpentine delay line(1995)64 cited
- → Preamorphization implantation-assisted boron activation in bulk germanium and germanium-on-insulator(2005)61 cited
- → The preparation and use of high surface area silicon carbide catalyst supports(1986)56 cited
- → Onset of blistering in hydrogen-implanted silicon(1999)54 cited