Heng-Chieh Chien
Industrial Technology Research Institute(TW)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Thermal properties of materials, Additive Manufacturing and 3D Printing Technologies, Thermal Radiation and Cooling Technologies
Most-Cited Works
- → Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film(2008)89 cited
- → Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications(2012)50 cited
- → Thermal conductivity of Si/SiGe superlattice films(2008)49 cited
- → Measurement and evaluation of the interfacial thermal resistance between a metal and a dielectric(2008)47 cited
- → Through-Silicon Hole Interposers for 3-D IC Integration(2014)46 cited
- → Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration(2013)42 cited
- → High-performance electrodeposited copper wicks for heat-spreading vapor chambers(2023)34 cited
- → Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)(2012)29 cited
- → Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP(2012)21 cited
- → Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips(2013)20 cited