M. Brillhart
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Polymer crystallization and properties, Mechanical Behavior of Composites, Polymer Nanocomposites and Properties
Most-Cited Works
- → Adhesion measurement for electronic packaging applications using double cantilever beam method(2000)66 cited
- → Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications(2012)50 cited
- → Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration(2012)40 cited
- → Reliability assessment of a high CTE CBGA for high availability systems(2003)35 cited
- → Fatigue fracture behaviour of PEEK: 2. Effects of thickness and temperature(1992)30 cited
- → Fatigue fracture behaviour of PEEK: 1. Effects of load level(1991)26 cited
- → Thermal expansion of the crystal lattice of novel thermoplastic polyimides(1995)26 cited
- → X-ray scattering and thermal analysis study of the effects of molecular weight on phase structure in blends of poly(butylene terephthalate) with polycarbonate(1996)25 cited
- → Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging(2000)24 cited
- → Polymer interfacial adhesion in microelectronic assemblies(2002)20 cited