Li-Ling Liao
Taiwan Semiconductor Manufacturing Company (Taiwan)(TW)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Silicon Carbide Semiconductor Technologies, 3D IC and TSV technologies, Advanced Thermoelectric Materials and Devices, Semiconductor materials and devices
Most-Cited Works
- → Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test(2014)47 cited
- → Through-Silicon Hole Interposers for 3-D IC Integration(2014)46 cited
- → Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration(2013)42 cited
- → Electro-thermal finite element analysis and verification of power module with aluminum wire(2014)31 cited
- → Low-cost TSH (through-silicon hole) interposers for 3D IC integration(2014)13 cited
- → Thermo-electric finite element analysis and characteristic of thermoelectric generator with intermetallic compound(2013)8 cited
- → Power cycling test and failure mode analysis of high-power module(2016)4 cited
- → Reliability analysis of copper bump interconnection in double-sided power module(2015)3 cited
- → Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process(2018)3 cited
- → Study on configuration design of interconnection in high power module(2014)2 cited