Zhi-Cheng Hsiao
ITRI International(US)Industrial Technology Research Institute(TW)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Additive Manufacturing and 3D Printing Technologies, CCD and CMOS Imaging Sensors, Nanofabrication and Lithography Techniques
Most-Cited Works
- → Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration(2011)40 cited
- → Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration(2012)32 cited
- → Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology(2015)28 cited
- → A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application(2012)22 cited
- → Wafer-to-wafer hybrid bonding technology for 3D IC(2010)22 cited
- → Wafer-level 3D integration using hybrid bonding(2010)20 cited
- → Flexible and ultra-thin embedded chip package(2009)14 cited
- → Low-cost TSH (through-silicon hole) interposers for 3D IC integration(2014)13 cited
- → A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices(2014)12 cited
- → Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration(2012)10 cited