Ren-Shin Cheng
Industrial Technology Research Institute(TW)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Nanofabrication and Lithography Techniques, Additive Manufacturing and 3D Printing Technologies, Electromagnetic Compatibility and Noise Suppression
Most-Cited Works
- → Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration(2011)40 cited
- → DNA-like interactions enhance the miscibility of supramolecular polymer blends(2008)37 cited
- → Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture(2012)33 cited
- → Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration(2012)32 cited
- → Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology(2015)21 cited
- → Performance and process characteristic of glass interposer with through-glass-via(TGV)(2013)20 cited
- → Investigation of the process for glass interposer(2013)15 cited
- → Reliability enhancements of chip-on-chip package with layout designs of microbumps(2013)14 cited
- → Low-cost TSH (through-silicon hole) interposers for 3D IC integration(2014)13 cited
- → Development of high throughput adhesive bonding scheme by wafer-level underfill for 3D die-to-interposer stacking with 30µm-pitch micro interconnections(2015)10 cited