Wei-Ti Lin
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Copper Interconnects and Reliability, Semiconductor materials and devices, Electromagnetic Compatibility and Noise Suppression
Most-Cited Works
- → 20" x 20" Panel Size Glass IPD Interposer Manufacturing(2016)13 cited
- → Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection(2019)2 cited
- → Glass 3D Solenoid Inductors IPD Substrate Manufacturing Assembly and Characterization(2016)2 cited