Wen-Liang Yeh
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability, 3D IC and TSV technologies, Organic Electronics and Photovoltaics, Semiconductor materials and devices
Most-Cited Works
- → 20" x 20" Panel Size Glass IPD Interposer Manufacturing(2016)13 cited
- → Synthesis and spectral characterizations of electroluminescent poly(2,3-di-[p-(2′-ethylhexoxy)phenyl]-1,4-phenylenevinylene)(2007)11 cited
- → 2/2um Embedded Fine Line Technology for Organics Interposer Applications(2016)10 cited
- → Photodetectors with an HIT structure on p-type crystalline Si wafers(2012)6 cited
- → Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection(2019)2 cited