Zhangming Zhou
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Electrical and Thermal Properties of Materials, Ferroelectric and Piezoelectric Materials, Silicon Carbide Semiconductor Technologies
Most-Cited Works
- → Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications(2016)142 cited
- → Mechanical Reliability of Thick Films for High-Temperature Packaging(2018)10 cited
- → Evaluation of Thick-Film Materials for High-Temperature Packaging(2018)10 cited
- → Investigation of Thick Film Technology for High Temperature Applications(2012)7 cited
- → DIP Test Socket Characterization for 300°C(2013)3 cited
- → Conductive Mechanism of Bi-Doped Thick-Film Dielectric in High-Temperature Aging With Bias(2018)2 cited
- Evaluation of thick film materials for high temperature electronics packaging(2017)
- → Component Attachment with Pressureless Sintering for 300°C Applications(2016)