Gokul Kumar
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Electromagnetic Compatibility and Noise Suppression, Nanofabrication and Lithography Techniques, Semiconductor materials and devices
Most-Cited Works
- → Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon(2014)136 cited
- → 3D-MAPS: 3D Massively parallel processor with stacked memory(2012)117 cited
- → Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)(2013)64 cited
- → Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications(2011)51 cited
- → Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC(2012)35 cited
- → Modeling, Fabrication, and Characterization of Low-Cost and High-Performance Polycrystalline Panel-Based Silicon Interposer With Through Vias and Redistribution Layers(2014)27 cited
- → Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages(2015)17 cited
- → Power delivery network analysis of 3D double-side glass interposers for high bandwidth applications(2013)7 cited
- → Investigation on memory package crack and prevention under temperature cycling test(2024)5 cited
- → Aggressively voltage overscaled adaptive RF systems using error control at the bit and symbol levels(2009)4 cited