Wayne Johnson
University of Utah(US)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Aerospace and Aviation Technology, Silicon Carbide Semiconductor Technologies, Aerospace Engineering and Control Systems
Most-Cited Works
- → Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review(1996)1,403 cited
- → The Changing Automotive Environment: High-Temperature Electronics(2004)849 cited
- → VTOL Urban Air Mobility Concept Vehicles for Technology Development(2018)318 cited
- → Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages(1991)201 cited
- → Mechanism of oxidisation of polyacrylonitrile fibres(1975)167 cited
- CAMRAD - A COMPREHENSIVE ANALYTICAL MODEL OF ROTORCRAFT AERODYNAMICS AND DYNAMICS(1994)
- → Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications(2016)142 cited