Kuan‐Neng Chen
Tokyo Institute of Technology(JP)National Yang Ming Chiao Tung University(TW)Winbond (Taiwan)(TW)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Additive Manufacturing and 3D Printing Technologies, Copper Interconnects and Reliability, Semiconductor materials and devices
Most-Cited Works
- → Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu(2015)240 cited
- → Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)(2017)220 cited
- → Wafer-level bonding/stacking technology for 3D integration(2009)190 cited
- → Wafer-level 3D integration technology(2008)176 cited
- → Low temperature bonding technology for 3D integration(2011)165 cited
- → Morphology and Bond Strength of Copper Wafer Bonding(2003)163 cited
- → Technology, performance, and computer-aided design of three-dimensional integrated circuits