Taigon Song
Kyungpook National University(KR)
Publications by Year
Research Areas
3D IC and TSV technologies, Semiconductor materials and devices, Advancements in Semiconductor Devices and Circuit Design, Low-power high-performance VLSI design, Electronic Packaging and Soldering Technologies
Most-Cited Works
- → High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)(2011)481 cited
- → Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring(2011)165 cited
- → PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models(2011)128 cited
- → 3D-MAPS: 3D Massively parallel processor with stacked memory(2012)117 cited
- → Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV)(2010)112 cited
- → Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC(2011)92 cited
- → Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer(2009)70 cited
- → Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)(2013)64 cited
- → Circuit-Level Exploration of Ternary Logic Using Memristors and MOSFETs(2021)45 cited
- → Opportunities and Challenges in Designing and Utilizing Vertical Nanowire FET (V-NWFET) Standard Cells for Beyond 5 nm(2019)39 cited