Yi‐Cheng Chu
Chunghwa Telecom (Taiwan)(TW)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Copper Interconnects and Reliability, Phytochemistry and Biological Activities, Phytochemicals and Antioxidant Activities
Most-Cited Works
- → Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu(2015)240 cited
- → Effect of anisotropic grain growth on improving the bonding strength of <111>-oriented nanotwinned copper films(2021)50 cited
- → Comparison of Various Solvent Extracts and Major Bioactive Components from Portulaca oleracea for Antioxidant, Anti-Tyrosinase, and Anti-α-Glucosidase Activities(2022)42 cited
- → Growth competition between layer-type and porous-type Cu 3 Sn in microbumps(2017)29 cited
- → Anisotropic grain growth to eliminate bonding interfaces in direct copper-to-copper joints using <111>-oriented nanotwinned copper films(2018)24 cited
- → Anti-Cancer and Anti-Inflammatory Activities of Three New Chromone Derivatives from the Marine-Derived Penicillium citrinum(2021)24 cited
- → Low-temperature and low-pressure direct copper-to-copper bonding by highly (111)-oriented nanotwinned Cu(2016)20 cited
- → Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests(2017)16 cited
- → Comparison of Various Solvent Extracts and Major Bioactive Components from Unsalt-Fried and Salt-Fried Rhizomes of Anemarrhena asphodeloides for Antioxidant, Anti-α-Glucosidase, and Anti-Acetylcholinesterase Activities(2022)16 cited
- → Application of metallic nanoparticle-biochars with ionic liquids for thermal transfer fluids(2020)14 cited