Shreepad Panth
Intel (United States)(US)
Publications by Year
Research Areas
3D IC and TSV technologies, Semiconductor materials and devices, Advancements in Photolithography Techniques, Interconnection Networks and Systems, VLSI and FPGA Design Techniques
Most-Cited Works
- → Design and CAD methodologies for low power gate-level monolithic 3D ICs(2014)118 cited
- → 3D-MAPS: 3D Massively parallel processor with stacked memory(2012)117 cited
- → Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs(2017)88 cited
- → High-density integration of functional modules using monolithic 3D-IC technology(2013)68 cited
- → Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations(2014)64 cited
- → Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)(2013)64 cited
- → Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs(2015)58 cited
- → Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs(2014)57 cited
- → Design challenges and solutions for ultra-high-density monolithic 3D ICs(2014)48 cited
- → Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs(2016)29 cited