Chang Liu
Tohoku University(JP)
Publications by Year
Research Areas
3D IC and TSV technologies, Additive Manufacturing and 3D Printing Technologies, Electronic Packaging and Soldering Technologies, Semiconductor materials and devices, Advanced Sensor and Energy Harvesting Materials
Most-Cited Works
- → 3D-MAPS: 3D Massively parallel processor with stacked memory(2012)117 cited
- → Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC(2011)92 cited
- → Micromachining process simulation using a continuous cellular automata method(2000)78 cited
- → Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory(2010)76 cited
- → Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)(2013)64 cited
- → Pre-Bond and Post-Bond Test and Signal Recovery Structure to Characterize and Repair TSV Defect Induced Signal Degradation in 3-D System(2011)59 cited
- → Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system(2010)56 cited
- → Ultra-high density 3D SRAM cell designs for monolithic 3D integration(2012)39 cited
- → Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs(2013)37 cited