Jiwoo Pak
Google (United States)(US)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability, VLSI and FPGA Design Techniques, Semiconductor materials and devices
Most-Cited Works
- → A graph placement methodology for fast chip design(2021)547 cited
- → Chip Placement with Deep Reinforcement Learning(2020)152 cited
- → Modeling of electromigration in through-silicon-via based 3D IC(2011)66 cited
- → Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs(2011)37 cited
- → Design for manufacturability and reliability for TSV-based 3D ICs(2012)31 cited
- → Robust clock tree synthesis with timing yield optimization for 3D-ICs(2011)24 cited
- → Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs(2014)17 cited
- → Electromigration-aware redundant via insertion(2015)16 cited
- → Electromigration-aware routing for 3D ICs with stress-aware EM modeling(2012)12 cited