Chien-Min Liu
National Yang Ming Chiao Tung University(TW)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability, Semiconductor materials and devices, Electrodeposition and Electroless Coatings, Ga2O3 and related materials
Most-Cited Works
- → Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper(2012)377 cited
- → Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu(2015)240 cited
- → Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition(2012)128 cited
- → Eliminate Kirkendall voids in solder reactions on nanotwinned copper(2012)110 cited
- → Grain growth in electroplated (111)-oriented nanotwinned Cu(2014)62 cited
- → Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈1 1 1〉 oriented and nanotwinned Cu(2013)61 cited
- → Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization(2014)58 cited
- → Direct probe of heterojunction effects upon photoconductive properties of TiO2nanotubes fabricated by atomic layer deposition(2010)55 cited
- → The Effect of Geometric Structure on Photoluminescence Characteristics of 1-D TiO2Nanotubes and 2-D TiO2Films Fabricated by Atomic Layer Deposition(2012)54 cited
- → Extremely anisotropic single-crystal growth in nanotwinned copper(2014)50 cited