David Ho
Agency for Science, Technology and Research(SG)Institute of Microelectronics(SG)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Electromagnetic Compatibility and Noise Suppression, Semiconductor Lasers and Optical Devices, VLSI and Analog Circuit Testing
Most-Cited Works
- → Heterogeneous 2.5D integration on through silicon interposer(2015)156 cited
- → Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications(2016)125 cited
- → Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology(2015)97 cited
- → Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging(2016)83 cited
- → Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application(2018)37 cited
- → Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package(2017)29 cited
- → Through Silicon Via interposer for millimetre wave applications